Scanning Acoustic Microscopy (SAM) is an imaging technique that uses ultrasound waves for the structural analysis of materials. In this technique, a piezoelectric transducer sends ultrasonic waves towards the sample that get scattered, absorbed, or reflected at the media interfaces. We conduct SAM testing per the standard protocols under laboratory conditions to assess the internal structure and defects of products. ... Read More
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Scanning Acoustic Microscopy (SAM)
Scanning Acoustic Microscopy (SAM) is a non-destructive imaging technique that employs ultrasound waves to investigate the internal structure, defects, etc. It is most widely used for the identification of sub-surface imperfections within devices, assemblies, and materials that cannot be resolved by optical microscopy. Other Scanning Acoustic Microscopy applications include failure analysis, detecting hidden defects in elastic, biological samples, and inspecting voids and delaminations in semiconductors. Also called Acoustic Micro Imaging (AMI) and Scanning Acoustic Tomography (SAT), a lateral resolution lower than 30 μm and a vertical resolution of a few nanometers can be achieved in the laboratory with this technique.
In SAM, a piezoelectric transducer sends ultrasonic waves towards the sample that get scattered, absorbed, or reflected at the media interfaces. An image is created from the signal reflected by the sample. Air and water-filled blisters, delaminations, cracks, and micro-fillers can be differentiated at the sub-micron level by this technique.
Our testing labs carry out Scanning Acoustic Microscopy (SAM) efficiently to provide the best results to our clients based in the USA and other parts of the world. We at Infinita Lab perform not only routine tests, but also custom tests designed in our testing labs as per the client’s specific requirements.
Scanning Acoustic Microscopy (SAM) Common Uses
Diagnosis of the damaged area of adhesive bonding of metals and fiber-reinforced composites, biocomposites, and biomaterials
Imaging the morphology, location, and size distribution of defects in printed circuit boards, underfills, voids, wire bonds, discrete components, and wafers
Imaging of the internal structure of ceramic capacitors and MEMS
Indication of the residual stress gradients during the scratch testing of the coating systems
Study of degradation and cathodic disbondment behavior of the coating
Detection of porosity in aluminum casting in laboratory
Detection of undersized and large resistance spot welds and low penetration depth of laser weld seam
Advantages of Scanning Acoustic Microscopy
Non-destructive tool for failure analysis purposes
The use of ultrasound waves enables the specification of a focal point by limiting diffraction, thus permitting more accurate results and increased data
Ability to probe subsurface regions where fractures and delaminations may be concealed from the view of traditional light-optical and electron-optical instruments
Wide range of low to ultra-high transducer frequency (~GHz) and focal lengths for optimized penetration and resolution for a variety of samples
Submicron delamination detectability (< 0.2um)
Limitations of Scanning Acoustic Microscopy
Slow processing time
Using high-frequency sound waves creates a greater potential for artifacts of surface preparation
Limited to polymer films with lower thickness, since at typical frequency, the penetration depth of ultrasound wave is limited to ~ 100 μm
Reduced imaging through multiple interfaces and layers, such as soft or porous materials
Industries served by Infinita Lab in the USA and other countries
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