Destructive Physical Analysis (DPA) is a systematic and stringent quality control procedure involving production lot sa mpling and destructive examination of mission critical electronic components. DPA is a tool for failure analysis and enables identification of parts having latent defects and to monitor or improve the manufacturing processes. The vast testing laboratories network of Infinita Lab, USA, offers this test to clients in the USA and across the world.... Read More
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Destructive Physical Analysis (DPA)
Destructive Physical Analysis (DPA) is a systematic and stringent quality control procedure involving sampling, destructive examination of selected samples from each production lot and preparing test documentation. DPA is typically applied to mission critical electronic, electromagnetic, and electromechanical parts used in space and launch vehicles and military applications, which are produced in large quantities. The DPA process ensures high quality of materials, component design, construction, and workmanship of the entire production lot by minute examination of statistically relevant sample quantities from the lot. DPA enables identification of parts having latent defects and to monitor or improve the manufacturing processes. It is also a tool for failure analysis and to monitor supplier production trends. Each DPA examination involves several levels and types of tests including external inspections, electrical tests, radiography, disassembly, sample preparation, microscope or scanning electron microscope (SEM) examinations.
The most frequently performed DPA tests include:
Particle Impact Noise Detection (PIND)
Internal Gas Analysis (IGA)
Prohibited Materials Analysis (PMA)
Certain micro-electronic external and internal microelectronic parts, package materials and external package plating and materials are subjected to prohibited material analysis due to reliability or environmental issues. X-ray fluorescence (XRF) and Scanning Electron Microscope Energy Dispersive Spectroscopy (SEM-EDS) are both considered in DPA protocol to determine prohibited materials like lead, cadmium and Zinc content in alloys and finishes.
Common Uses of Destructive Physical Analysis (DPA)
Quality control of High reliability electronic components
Continual improvement of production Processes (quality assurance)
Screening of electronic component parts to significantly increase reliability of products.
Advantages of Destructive Physical Analysis (DPA)
Mandates extremely detailed examination of selected samples using an array of stringent tests in accordance with specified procedure
Patent and latent defects can be identified
Limitations of Destructive Physical Analysis (DPA)
Challenging to perform DPA on very small components
Industrial Applications of Destructive Physical Analysis (DPA)
Commercial, high reliability electronic and automation products
ASTM E572 test method covers the analysis of stainless and alloy steels by Wavelength Dispersive X-ray Fluorescence Spectrometry (WDXRF). It provides rapid, multi-element determinations with sufficient accuracy to assure product quality.
The ASTM D2674 is a standard test method for the analysis of sulfochromate etches solution used in the surface preparation of aluminum. The ASTM D2674 standard specifies a method for determining the efficacy of an etchant used to prepare the surface of aluminum alloys for subsequent adhesive bonding.
An immunological method for quantization of Hevea Natural Rubber (HNRL) proteins using rabbit anti-HNRL serum. Rabbits immunized with HNRL proteins react to the majority of the proteins present, and their sera have the capability to detect most if not all the proteins in HNRL.
ASTM G65 measures the resistance of metallic materials to abrasion using the dry sand/rubber wheel apparatus. The quality, durability, and toughness of the sample are determined using this test. Metallic materials are ranked in their resistance to scratching abrasion under a controlled environment.
ASTM E2141 test methods provide accelerated aging and monitoring of the performance of time-dependent electrochromic devices (ECD) integrated in insulating glass units (IGU). This test helps to understand the relative serviceability of electrochromic glazings applied on ECD.
ASTM C724 test method is used in analyzing the quality and ease of maintenance of a ceramic decoration on architectural-type glass. This test method is useful in the acknowledgment of technical standards.
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