Destructive Physical Analysis (DPA)

Destructive Physical Analysis (DPA) is a systematic and stringent quality control procedure involving production lot sampling and destructive examination of mission critical electronic components. DPA is a tool for failure analysis and enables identification of parts having latent defects and to monitor or improve the manufacturing processes. The vast testing laboratories network of Infinita Lab, USA, offers this test to clients in the USA and across the world.

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     Destructive Physical Analysis (DPA)

    Destructive Physical Analysis (DPA) is a systematic and stringent quality control procedure involving sampling, destructive examination of selected samples from each production lot and preparing test documentation. DPA is typically applied to mission critical electronic, electromagnetic, and electromechanical parts used in space and launch vehicles and military applications, which are produced in large quantities. The DPA process ensures high quality of materials, component design, construction, and workmanship of the entire production lot by minute examination of statistically relevant sample quantities from the lot. DPA enables identification of parts having latent defects and to monitor or improve the manufacturing processes. It is also a tool for failure analysis and to monitor supplier production trends. Each DPA examination involves several levels and types of tests including external inspections, electrical tests, radiography, disassembly, sample preparation, microscope or scanning electron microscope (SEM) examinations.

    The most frequently performed DPA tests include:

    • External Visual
    • External X-Ray
    • Particle Impact Noise Detection (PIND)
    • Hermeticity
    • Internal Visual
    • Internal Gas Analysis (IGA)
    • Die Shear
    • Wire Pull
    • Prohibited Materials Analysis (PMA)

    Certain micro-electronic external and internal microelectronic parts, package materials and external package plating and materials are subjected to prohibited material analysis due to reliability or environmental issues. X-ray fluorescence (XRF) and Scanning Electron Microscope Energy Dispersive Spectroscopy (SEM-EDS) are both considered in DPA protocol to determine prohibited materials like lead, cadmium and Zinc content in alloys and finishes.

     Common Uses of Destructive Physical Analysis (DPA)

    • Quality control of High reliability electronic components
    • Continual improvement of production Processes (quality assurance)
    • Screening of electronic component parts to significantly increase reliability of products.

     Advantages of Destructive Physical Analysis (DPA)

    • Mandates extremely detailed examination of selected samples using an array of stringent tests in accordance with specified procedure
    • Patent and latent defects can be identified

     Limitations of Destructive Physical Analysis (DPA)

    •  Destructive testing
    •  Challenging to perform DPA on very small components

     Industrial Applications of Destructive Physical Analysis (DPA)

    •  Aerospace Sector
    •  Commercial, high reliability electronic and automation products
    •  Military applications
    •  Medical device sector

    More Details:

     S-311-M-70C – Destructive Physical Analysis (nasa.gov)

     NASA GSFC EEE Parts: DPA and FA Summary

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