Reality Time X-Ray Inspection and Imaging Analysis

X-Ray Inspection and Imaging Analysis in real time

X-ray inspection and imaging analysis in real-time are done by Soldering the Interconnection Bump Wire Bond Breakage Solder Void Short / Open Circuits Missing Solder Balls, Drill quality, Die to attach, and Solder Joint Void Offset.

A sample can be internally inspected while being moved and rotated using real-time X-ray technology. If there are any internal flaws or concealed problems, they can be found by looking at the sample’s internal construction. The microelectronic, semiconductor, aerospace, and automotive industries can internally inspect small devices, packages, and components with high magnification and resolution thanks to ITL’s X-Ray Systems.

This non-destructive method provides a quick and in-depth investigation of structures with different densities. Printed circuit boards, ceramic, metal, and plastic packages, ball grid arrays, and other electrical and automotive components are among the applications.

The Nicolet NXR-1400 X-ray Inspection System features a side window x-ray tube, a 120 kV x-ray source with a 10 m focused spot, and 65x magnification capability.

The 10 to 110 kV x-ray source is used in the Hewlett-Packard Faxitron 43855 A cabinet x-ray system.