Thermal Shock Testing

Thermal shock testing mimics real-world usage scenarios for components and products that experience frequent temperature swings. The test has two goals: to see if the test object can meet performance standards after exposure to abrupt temperature changes in the environment, and to see if the thermal shock test object can be used safely after exposure to the abrupt temperature change in the environment.

Thermal Shock Testing

Thermal shock testing simulates service conditions for products and components that undergo rapid cycles of temperature changes. Some examples include external aircraft installations that have to withstand the rapid change in temperatures, transportation, production processes like soldering, self-heating of power semiconductors, component failures in electronic devices and circuits due to rapid changes in temperature, etc. Industries like packaging, aircraft, electronics, etc., rely on thermal shock testing to characterize their products’ durability.

Testing is performed in single or double chambers depending on the industry-standard or the rate of temperature change required for the testing specimen. Single chamber testing typically employs a constant rate of change as high as 30C per minute. For a more severe rapid shift in temperature testing, the sample is transferred from one temperature extreme to another within a two-zone system. Specialty testing includes cryogenic shock testing for space launch vehicles, electronics and related components, pressurized temperature shock testing, etc. Visual inspection, electrical and mechanical testing, etc., are conducted on the samples, where required, to assess failures from temperature shock.

The lower and upper temperatures must be precisely calculated prior to thermal shock testing. Higher acceleration factors will be the result of greater temperature differences between the test chamber and the product’s regular use temperatures. To avoid exceeding the product’s operational or material property restrictions, the suitable temperature limits must be chosen.

The thermal mass of the samples, their number, and the airflow around them, which is dependent on the sample spacing in the chamber, are all variables that can affect the test parameters. Along with the tolerances around the high and low temperatures, the test specification should also contain the dwell time at each temperature. There may be minimum rates of temperature change specified in test techniques. The thermal shock test may be performed on powered or unpowered products. 

Video 01: Thermal shock Testing

Thermal Shock Testing

• MIL-STD-202, Method 107, Thermal Shock
• MIL-STD-810, Method 503, Temperature Shock
• MIL-STD-883, Method 1010, Temperature Cycling
• JESD22-A104D, Temperature Cycling
• Cryogenic testing with liquid N2
• Air-to-air thermal shock
• Liquid-to-liquid thermal shock

Products Tested

• Aircraft components
• Packaging materials
• Electronic components
• Underhood components
• Soldering joints
• Sattlelite and other launch components
• Surface modifiers and coatings

Industries

• Aircraft
• Automotive
• Military
• Consumer Electronics
• Electronic Components
• Semiconductors
• Aerospace
• Spacecraft

Thermal Shock Testing Laboratories

• National Technical Services (NTS)
• Experior Laboratories
• Delserro Engineering Solutions
• Applied Technical Services
• Oneida Research Services, Inc.
• Sithers, Inc.

More Details

• Basics of thermal shock testing
• Thermal shock testing methodologies and testing chambers