(888) 878-3090
In order to find and fix faults, this topic focuses on testing and analysing printed circuit boards (PCBs). In order to make sure PCBs fulfil quality and reliability criteria, it examines several testing techniques, such as electrical testing, functional testing, and environmental testing. It also discusses methods for failure analysis that can be used to identify problems, fix them, and improve PCB performance and system functionality as a whole.... Read More
One of the pillars of contemporary electronics is the printed circuit board. Without contemporary high-density circuit board technology, it would be impossible to build even relatively simple consumer electronics with the sheer number of components and interconnects needed to join them. Clearly, this increased level of complexity creates new difficulties for failure analysis; for example, locating an open trace may take hours of arduous work looking over board layouts and innumerable microsurgeries on the board before the faulty node is eventually isolated. Even after the failure has been identified through comprehensive printed circuit board testing, an analyst still faces challenges since they must figure out how to locate the hidden problem.
Thankfully, a variety of tools have been created that can significantly help an analyst get to the heart of a PCB. By allowing an analyst to image the entire board in search of hot areas brought on by leakage rather than cutting and probing individual nodes on the board, tools like thermal imaging can substantially simplify the printed circuit board testing process. Time domain reflectometry is an additional helpful technique for pinpointing open-circuit issues on a printed circuit board and requires little setup.
The analyst’s next challenging task is to identify the flaw that will be photographed when printed circuit board testing and isolation are complete. The general strategy is to mount the board for parallel deprocessing in a manner akin to that of mounting an integrated circuit for delayering. Using this method, an analyst can gradually remove each layer of the board while tracking the winding path traveled by a signal of interest until the flaw is discovered. Conversely, an analyst may decide to cross-section the device and search for flaws that span multiple layers as opposed to those that are restricted to a single plane.
The work of printed circuit board testing becomes more difficult as PCBs are denser (many modern consumer gadgets have boards that compress ten or more conductive layers into a region that is less than one millimeter thick). It takes patience, the right equipment, and experience gained from years of exposure to cutting-edge PCB technology to find flaws in these mazes of copper and epoxy.
Video 01: PCB Failure Analysis | FT-IR Microscopy | Electronics
hello@infinitalab.com
Provide your contact information
Δ
Scope: The standard guide ASTM F2150 describes the available standard methods for the characterization and testing of biomaterial scaffolds used...
Autoclaving Rubber or Vulcanized Rubber Autoclaves are large chambers that use high pressures and heat to speed up industrial processes....
Environmental Vibration Testing Technique Environmental vibration testing combines vibration testing with different environmental conditions such as high temperature and low...
EELS analysis of gate and channel is performed on fin field-effect transistors (finFETs). Scanning transmission electron…
FTIR analysis is used to study the migration and leaching of phthalate plasticizers from p-PVCs. Phthalate…
Nano-scale surface roughness is a critical parameter in fabricated thin-films that are used in optics, solar…
Start Testing
ASTM E572 test method covers the analysis of stainless and alloy steels by Wavelength Dispersive X-ray Fluorescence Spectrometry (WDXRF). It provides rapid, multi-element determinations with sufficient accuracy to assure product quality.
The ASTM D2674 test is a standard test method for the analysis of sulfochromate etch solutions used in the surface preparation of aluminum. The ASTM D2674 standard specifies a method for determining the efficacy of an etchant used to prepare the surface of aluminum alloys for subsequent adhesive bonding.
An immunological method for quantization of Hevea Natural Rubber (HNRL) proteins using rabbit anti-HNRL serum. Rabbits immunized with HNRL proteins react to the majority of the proteins present, and their sera have the capability to detect most if not all the proteins in HNRL.
ASTM G65 measures the resistance of metallic materials to abrasion using the dry sand/rubber wheel apparatus. The quality, durability, and toughness of the sample are determined using this test. Metallic materials are ranked in their resistance to scratching abrasion under a controlled environment.
ASTM E2141 test methods provide accelerated aging and monitoring of the performance of time-dependent electrochromic devices (ECD) integrated in insulating glass units (IGU). This test helps to understand the relative serviceability of electrochromic glazings applied on ECD.
ASTM C724 test method is used in analyzing the quality and ease of maintenance of a ceramic decoration on architectural-type glass. This test method is useful in the acknowledgment of technical standards.
Subscribe now to keep reading and get access to the full archive.
Type your email…
Subscribe
Continue reading
Start Material Testing
Contact Detail
Talk to Experts
Please provide few more details before we connect with you.
Full Name
What Material or product do you have?
What analysis do you need?
How many parts or coupons do you have?
How fast do you need the results back?
Submit