Printed Circuit Board (PCB) Analysis

Written by Rahul Verma | Updated: September 18, 2025

Printed Circuit Board (PCB) Analysis

Written by Rahul Verma |  Updated: September 18, 2025

Printed Circuit Board (PCB) analysis

The requirements for assembling PCBs are raw materials and a variety of components. Printed Circuit Board (PCB) analysis includes the following; measuring various plate thicknesses, identifying foreign materials, discovering defective parts, and also using cross-sectional examinations. 

A considerable loss of end-of-line, first-pass assembly yields occurs in a high-mix, low-volume environment where Electronics Manufacturing Services (EMS) providers operate. This loss is caused by suboptimal procedures coupled with insufficient process control and a lack of training. Therefore, rather than being reactive, an EMS supplier would benefit greatly from adopting a proactive strategy to mitigate the potential loss of PCB yield.

In an assembly setting, a great deal of effort is spent on problem-solving rather than determining the root cause(s), which results in minor and commonplace day-to-day issues. In order to detect and remove these “process clouds,” it is required to perform a comprehensive investigation. This will lead to smoother and more efficient daily operations.

Video 01: Understanding a Printed Circuit Board (PCB) and its connections

Tools you’ll need to test a Printed Circuit Board (PCB)

  • Analog/Digital multimeter.
  • Magnifying glass.
  • Desoldering station.
  • Soldering gun.

Common Uses for PCBs

Advantages of Printed Circuit Board

  • Compact size
  • Time saving
  • Reduced Electronic Noise
  • Lower Price

Limitation of PCBs

  • Not easy to repair once damaged
  • It contains lead
  • Thermal shock

More Details: How to Test a Printed Circuit Board That Stops Working

1. Start with a Visual Inspection

2. Check the power module

3. Check the Input/outputs ports

4. Check communication ports

Read more: Printed Circuit Board Tests – Identifying Potential Points of Failure

ABOUT AUTHOR

Rahul Verma

Rahul Verma is a dedicated Materials Scientist and Testing Associate with strong expertise in materials characterization, thermal spray coatings, and advanced manufacturing technologies. With a solid foundation in Materials Science & Engineering and hands-on research in additive manufacturing, he specializes in bridging material behavior insights with practical engineering solutions. Currently serving as a Materials Testing Associate at Infinita Lab Inc. (USA), Rahul ensures precise material testing, quality assurance, and customer-focused solutions that help clients overcome complex materials challenges.

His role blends technical rigor with operations and project management, driving efficiency, reliability, and client satisfaction. Rahul’s journey spans academic and industrial research at IIT Patna, where he has contributed to advancements in plasma spray techniques, AI/ML-driven material design, and additive manufacturing.

He has also co-founded GreeNext Materials Group, pioneering sustainable battery regeneration technologies that have a significant impact on both industrial and societal applications. With professional experience in operations leadership, R&D, and client engagement, Rahul brings a results-oriented and analytical approach to materials engineering. He continues to advance innovation in coatings, material performance, and testing methodologies—focusing on durability, sustainability, and real-world applications.

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