Printed Circuit Board Tests – Identifying Potential Points of Failure

Written by Dr. Bhargav Raval | Updated: February 10, 2026

Printed Circuit Board Tests – Identifying Potential Points of Failure

Written by Dr. Bhargav Raval |  Updated: February 10, 2026

As the needs of modern technology have grown, it has become harder to produce high-quality, dependable printed circuit boards. The unstoppable march of technological development has necessitated the design of ever-complexer circuits, frequently with far stricter limitations imposed on factors like board size and power consumption. It is essential now more than ever to be able to continuously identify and address process weaknesses in order to generate the greatest number of functional devices because complexity inevitably increases the chance for failure. Thankfully, a number of printed circuit board tests can be utilised to assess a product’s quality.

A destructive physical analysis is one of the more demanding tests that can be carried out on a printed circuit board (DPA). Despite its name, a DPA begins with a non-destructive inspection of the board that is received, with a focus on evaluating the process quality of elements such plated through-holes, solder mask, and conductor trace spacing. Optical microscopy and x-ray imaging are typically used to carry out this inspection. The board will next be cut into numerous different cross-sections to collect information about the uniformity of the PCB manufacturing process. Dielectric and conductor measurements are made to make sure the boards meet or surpass minimal requirements, and the overall design of the board is also assessed. The vias and through-holes on the board are given particular consideration so that any stress cracking or faulty plating can be found. The integrity of the solder joints connecting the board and its devices can also be checked via cross-sectioning if the board has been populated with components.

In order to confirm conformity with the Restriction on Hazardous Substances (RoHS) directive, an audit may also be performed on a populated board. One of the most popular printed circuit board tests, a RoHS audit, examines if a certain PCB complies with RoHS requirements that consumer electronics be free of a few substances and elements that pose substantial ecological concerns. The main instruments required for the audit are elemental analysis equipment, such as energy dispersive spectroscopy or x-ray fluorescence, and can evaluate either full boards or cross-sections thereof. A RoHS audit can be carried out as a standalone analysis or as part of a DPA.

Due to the increasingly thorough nature of the analysis, there is a growing demand for external test services as printed circuit boards become more complicated. In order to execute efficient, meaningful analysis, it is frequently required to subcontract DPA or RoHS audits to outside companies.

ABOUT AUTHOR

Dr. Bhargav Raval is a Materials Scientist and Client Engagement Engineer with expertise in nanomaterials, polymers, and advanced material characterization. He holds a Ph.D. in Nanosciences from the Central University of Gujarat, where his research focused on graphene-based materials for flexible electronics. Professionally, he has led R&D in sensor technologies and coatings, including polymer-functionalized piezoelectric sensors for breath-based cancer diagnostics. In his current role, Dr. Raval works closely with clients to understand technical requirements, design testing strategies, and deliver tailored solutions in materials selection, failure analysis, and performance evaluation. He effectively bridges scientific depth with practical outcomes, ensuring client-focused project execution. With peer-reviewed publications in high-impact journals and a proven record of applying materials science to real-world challenges, Dr. Raval continues to drive innovation at the intersection of research, engineering, and client engagement.
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