The air-to-air thermal shock test evaluates the reliability of specimens by repeatedly exposing them to rapid alternating high and low temperatures. Expansion and contraction due to temperature changes generate stresses due to differences in the expansion rates of parts made of different bonding materials.
Thermal shock testing is performed to analyze the behavior of a product when they are abruptly exposed to extreme temperatures for a short period of time. Rapid cycling of temperature extremes causes product deformation such as dislocations within components and microstructures.
The air-to-air thermal shock test evaluates the reliability of specimens by repeatedly exposing them to rapid alternating high and low temperatures. Different heat capacities and thermal time constants of device components also cause stress. When these stresses are repeatedly applied, cracks and fractures occur. Fatigue accumulates due to repeated application of stress, and may fracture at a strength lower than the static strength. Repeated stress can crack bonded parts, delaminate coatings, and loosen screws.
Video 01: Thermal shock testing
Common Uses of Thermal Shock Test
Advantages of Thermal Shock Test
Industrial applications of Thermal Shock Test
This test is conducted to validate mechanical, electronic, and structural products used in semiconductor, construction equipment, electronics, and aerospace applications, where these products are subjected to persistent temperature gradients.
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