How To Perform Failure Analysis Using Decapsulation

Among failure analysis methods for integrated circuits, failure analysis utilizing decapsulation holds a major position. However, decapsulation will render the package unusable and other techniques ineffective as well; thus, a failure analysis engineer must exercise discretion while utilizing it. Decapsulation failure analysis follows microscopy or radiography in this regard so testers can choose which decapsulation method to employ. Decapsulation is disassembling an integrated circuit to look at its parts. Disassembling the package could destroy components that need inspection. Decapsulation-based failure analysis, therefore, involves already knowing what to look at.

Decapsulation is a technique that is frequently used in failure analysis to look into the root causes of electronic component and integrated circuit or IC failures. The encapsulating material must be carefully removed to reveal the interior structures and allow for a thorough examination. The reasons for failures, including bond wire failures, solder joint cracks, or abnormalities, can be found through visual inspection, microscope analysis, material characterization, and electrical testing. The analysis’ findings offer insightful information that can be used to pinpoint design faults, manufacturing problems, or environmental conditions that contributed to the failure. For precise and successful failure analysis employing decapsulation, appropriate methods, safety precautions, and skill in microscopy and analysis techniques are required.

Any of the numerous methods will be used during decapsulation to open the package. They can include laser or jet etching as well as merely prying the substrates apart. Certain IC decapsulation procedures demand that the box be heated before the components are ground apart. In contrast to conventional etching methods (such as laser, hand, or jet etching), this technique will damage bond wires while leaving the die intact. Failure analysis utilizing manual etching exposes the package to corrosive acids to remove the plastic covering the die. Different acids might be administered to the packaging at stages during this process. The package may be immersed in an acidic bath during subsequent procedures. In any case, after proper drying, the acid will burn off the plastic and allow for inspection of the package’s interior.

Jet etching is a more accurate method of failure analysis that employs decapsulation. During this procedure, a jet etcher sprays acid on the area of the package that needs to be removed while shielding the remaining space. Although less messy and more effective, failure analysis via decapsulation by jet etching still renders the package useless.

Video 01: Integrated circuit failure analysis