MIL-STD-883, Method 1010, Temperature Cycling
MIL-STD-883, Method 1010, Temperature Cycling
The temperature cycling procedure specified in MIL-STD-883, Method 1010, typically involves exposing the components or assemblies to a range of temperatures that vary from low to high and back again over a specified period that produces low/medium-frequency mechanical stresses. The test is designed to assess the reliability and durability of the components or assemblies and to look for any potential issues that may arise due to exposure to temperature changes.
The test chambers used in the thermal cycling lab must be able to supply and manage the required temperatures in the working zone under maximum load. In the chamber, specimens are positioned so the airflow across and around them is not obstructed. The specimen is then constantly exposed to the prescribed condition for the number of cycles. To get the best outcome for temperature cycling testing, the transfer time from hot to cold or cold to hot medium must not be more than one minute.
At least 10 rounds of this test are run. The total number of cycles required to complete the test may be interrupted due to equipment malfunction, device loading or unloading, or power outages.
After the last cycle, the marking is examined externally with a magnification no higher than 3X. Any damage or flaw to the case leads, seals or other components is a failure. Also, any deviation from stated end-point measurements is regarded as a failure.
Video 01: Temperature Cycle Test
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