ASTM F22 Hydrophobic Surface Film

Scope:

ASTM F22 enables the detection of the molecular layer of hydrophobic organic contaminants. The test’s sensitivity may vary greatly on particularly porous or rough surfaces. The technique is widely used to verify the absence of surface impurities on metal surfaces that may interfere with future surface treatments such as priming, conversion coating, anodizing, plating, or adhesive bonding. It is used in the manufacturing process, cement and soil industries, and research manufacturing plants. 

Procedure:

ASTM F22 uses a water-break test, which employs flowing water that forms a film over the surface. When there are water breaks, hydrophobic residues are present. This kind of testing is effective for finding thick fingerprints and process oil coatings. In general, ASTM F22 is not appropriate for applications requiring precision cleaning but is frequently used for component washing. It does not readily detect non-hydrophobic contaminants.

Result:

In the ASTM E1090 test method, the peroxide content of uncured PE and EVA samples is determined to manage the degree of crosslinking in the cured product. Understanding residual quantities of peroxide or its breakdown products (dimethyl benzyl alcohol and acetophenone) in the cured product’s end-use applications is particularly significant since these levels might impact the product’s end-use applications. The technique outlined in this test method determines the concentration of these chemicals in the solution. 

Conclusion: 

Specimen size: 

For the test of ASTM F21, a simple hydrophobic surface that can repel water is required. 

Data: 

The values stated in SI units are to be regarded as standard. This test technique is not quantitative and is usually limited to tasks where a pass/fail evaluation of cleanliness is sufficient.

Conclusion: ASTM F22 enables the detection of the molecular layer of hydrophobic organic contaminants. The technique is widely used to verify the absence of surface impurities on metal surfaces that may interfere with future surface treatments such as priming, conversion coating, anodizing, plating, or adhesive bonding.