Failure Analysis Services

Scope

Failure analysis covers the systematic investigation of material and component failures to determine the failure mode, mechanism, and root cause, using a combination of examination, characterization, and testing techniques selected based on the failure.

Key techniques used in failure analysis include:

• Visual examination and documentation – recording the as-received condition of the failed component, including fracture surfaces, deformation, discoloration, and associated damage, before any destructive work
• Fractography – examination of fracture surfaces by optical microscopy and SEM to identify fracture mode (overload, fatigue, SCC, intergranular, etc.) from the fracture morphology and features
• SEM-EDS – scanning electron microscopy with energy-dispersive X-ray spectroscopy for high-magnification imaging of fracture surfaces, microstructure, and corrosion products, combined with elemental identification of deposits, inclusions, and contaminants
• Metallographic examination – cross-sectioning, mounting, polishing, and etching to examine the microstructure, grain structure, defects, case depth, and secondary cracking
• Chemical analysis – verifying material composition by OES, XRF, ICP, or wet chemistry to confirm the material is what it was specified to be
• Mechanical testing – hardness, tensile, and impact testing to verify mechanical properties and assess material condition
• NDT – non-destructive techniques (radiography, ultrasonic, penetrant, magnetic particle) for detecting internal and surface defects
• Failure modes addressed – overload, fatigue, stress corrosion cracking, corrosion, wear, creep, hydrogen embrittlement, material and processing defects, thermal degradation, and environmental effects

Applications

• Field failure investigation – determining why a component failed in service to support corrective action, warranty resolution, or safety investigation
• Premature fracture and fracture surface analysis – identifying whether a fracture was caused by overload, fatigue, SCC, or another mechanism from the fractographic evidence
• Corrosion failure investigation – determining the type and cause of corrosion (general, pitting, crevice, galvanic, SCC, intergranular) and identifying the contributing factors
• Weld failure analysis – examining weld cracks, underbead cracking, HAZ failures, and weld defects to determine whether the failure was a weld quality issue, a design issue, or a service loading issue
• Electronics and PCB failure analysis – analyzing solder joint failures, delamination, electromigration, and component failures in electronic assemblies
• Polymer and composite failure – determining the cause of fracture, delamination, degradation, or premature aging in plastic and composite components
• Litigation and insurance support – providing a documented, defensible root cause finding supported by analytical evidence for legal, insurance, or dispute-resolution purposes
• Process and design improvement – using failure findings to correct a manufacturing process, design weakness, or material selection that is causing recurring failures

Benefits

• Identifies the actual root cause, not just the symptom – systematic failure analysis finds the underlying cause (wrong material, design flaw, processing defect, environmental factor) rather than just observing that something broke
• Prevents recurrence – a defensible root cause finding enables targeted corrective action, so the same failure does not happen again in the next batch or the next product generation
• Multi-technique approach resolves ambiguity – combining fractography, microstructural examination, chemical analysis, and mechanical testing provides corroborating evidence, so conclusions are well supported rather than speculative
• Critical for safety-critical and high-cost components – for aerospace, pressure equipment, automotive, and medical device failures, understanding root cause is essential to safety and to managing liability
• Supports material and process qualification – failure analysis of test specimens and prototypes during development identifies weaknesses early, before they become field failures
• Provides documented evidence – the structured investigative report with photographic and analytical evidence supports warranty claims, supplier disputes, and legal proceedings