ASTM F417 Test for Modulus of Rupture of Electronic-Grade Ceramics

ASTM F417 is used to determine the Modulus of Rupture or flexural strength of Electronic-Grade Ceramics by flexural bend ing tests. The values are stated in imperial units. The data obtained is helpful in product designing using Electronic-Grade Ceramics for successful end use.... Read More

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    ASTM F417 determines flexural strength or modulus of rupture of electronic grade ceramics. Modulus of Rupture is a measure of a specimen’s strength before rupture. The data is used by manufacturers in the quality control and selection process of Electronic-Grade Ceramics.

    Test Procedure:

    In ASTM F417, the two most common types of flexure tests are employed – three-point and four-point flexural bending tests. The three-point bend test consists of the sample placed horizontally upon two points and the force applied to the top of the sample through a single point so that the sample is bent in the shape of a “V”. 

    A four-point bend test is roughly the same except that instead of the force applied through a single point on top it is applied through two points so that the sample experiences contact at four different points and is bent more in the shape of a “U”. 

    In the ASTM F417 testing method, the three-point flexure test is ideal for the testing of a specific location of the sample, whereas, the four-point flexure test is more suited towards the testing of a large section of the sample, which highlights the defects of the sample better than a 3-point bending test.

     Specimen size:

    ASTM F417 test method applies to specimens prepared from ceramic blanks with dimensions of at least 0.080 by 0.080 by 1 1/8 in. (2.0 by 2.0 by 28.6 mm).


    Modulus of rupture calculation for ASTM F417

    1. For circular specimen: 

      M = 8PL/πd3

    2. For rectangular specimen: 

    M = 3 PL/2bd2


    M = modulus of rupture

    P = load at rupture

    L = distance between supports

    d = diameter of specimen


    ASTM F417 is used to determine the Modulus of Rupture or flexural strength of Electronic-Grade Ceramics by flexural bending tests. 


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