Test for Modulus of Rupture of Electronic-Grade Ceramics ASTM F417
ASTM F417 is used to determine the Modulus of Rupture or flexural strength of Electronic-Grade Ceramics by flexural bending tests. The values are stated in imperial units. The data obtained is helpful in product designing using Electronic-Grade Ceramics for successful end use.
ASTM F417 determines flexural strength or modulus of rupture of electronic grade ceramics. Modulus of Rupture is a measure of a specimen’s strength before rupture. The data is used by manufacturers in the quality control and selection process of Electronic-Grade Ceramics.
The two most common types of flexure tests are three-point and four-point flexural bending tests. The three-point bend test consists of the sample placed horizontally upon two points and the force applied to the top of the sample through a single point so that the sample is bent in the shape of a “V”.
A four-point bend test is roughly the same except that instead of the force applied through a single point on top it is applied through two points so that the sample experiences contact at four different points and is bent more in the shape of a “U”.
The three-point flexure test is ideal for the testing of a specific location of the sample, whereas, the four-point flexure test is more suited towards the testing of a large section of the sample, which highlights the defects of the sample better than a 3-point bending test.
This test method applies to specimens prepared from ceramic blanks with dimensions of at least 0.080 by 0.080 by 1 1/8 in. (2.0 by 2.0 by 28.6 mm).
Modulus of rupture
For circular specimen:
M = 8PL/πd3
For rectangular specimen:
M = 3 PL/2bd2
Where: M = modulus of rupture P = load at rupture L = distance between supports d = diameter of specimen
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