Laser Decapsulation Services for Semiconductor Failure Analysis
Decapsulation, which involves removing a protective plastic shell to access circuitry inside, is an important step in failure investigations. Although routinely used, wet-etch procedures involving acids or solvents demand safety precautions. Although it can be costly, chemical decapsulation prevents component failure. An experimental alternative approach called laser decapsulation has the potential to reduce chemical dangers while protecting integrated circuits.
TRUSTED BY
- Overview
- Scope, Applications, and Benefits
- Test Process
- Specifications
- Instrumentation
- Results and Deliverables
Laser Decapsulation Overview
Laser decapsulation is a precision technique used in failure analysis to remove encapsulating material from semiconductor devices without damaging the underlying die or internal structures. It uses controlled laser energy to selectively ablate plastic or epoxy packaging, enabling direct access to critical components such as bond wires, die surfaces, and interconnects for inspection.
This method is widely used in microelectronics failure analysis because it offers high accuracy, minimal mechanical stress, and localized material removal. Compared to chemical or mechanical decapsulation, laser-based techniques reduce the risk of contamination and structural damage. It supports rapid fault isolation, defect identification, and detailed internal inspection of integrated circuits and packaged semiconductor devices.
Scope, Applications, and Benefits
Scope
Laser decapsulation is applied to expose internal structures of semiconductor devices for detailed inspection, fault diagnosis, and reliability assessment. It is particularly useful for sensitive and high-density electronic packages where precision is critical.
- Covers plastic-encapsulated microcircuits and IC packages
- Enables access to die, bond wires, and internal interconnects
- Suitable for failure analysis and reverse engineering studies
- Minimizes risk of mechanical or chemical damage
- Applicable to advanced semiconductor packaging technologies
- Supports microelectronics quality control and defect analysis
- Used in research, reliability testing, and forensic electronics
- Allows selective and localized material removal
Applications
- Semiconductor failure analysis and fault isolation
- Integrated circuit internal inspection
- Reverse engineering of electronic devices
- Quality control in microelectronics manufacturing
- Reliability assessment of packaged components
Benefits
- Non-contact and highly precise material removal
- Reduces risk of damage to sensitive internal structures
- Faster and cleaner compared to chemical methods
- Enables targeted exposure of specific regions
- Improves accuracy in failure diagnostics
Laser Decapsulation Process
Device Preparation
Semiconductor package is cleaned and positioned for precise laser targeting.
1Laser Parameter Setup
Laser power, pulse duration, and focus are optimized based on encapsulant material.
2Controlled Ablation
Laser selectively removes encapsulating material layer by layer without affecting internal structures.
3Inspection and Analysis
Exposed die and interconnections are examined using microscopy for defect identification.
4Laser Decapsulation Technical Specification
| Parameter | Details |
|---|---|
| Method | Focused laser ablation of encapsulating materials |
| Measurement Type | Controlled material removal and exposure of internal structures |
| Sample Type | Plastic or epoxy encapsulated semiconductor devices |
| Loading Type | Thermal and photonic energy-induced ablation |
| Measurement Basis | Selective removal without damaging die, bond wires, or interconnects |
| Units | µm depth, laser power (W), pulse duration (ns/fs) |
| Laser Type | UV, IR, or femtosecond laser systems |
Instrumentation Used for Testing
- Laser ablation system (UV or femtosecond laser)
- High-precision positioning stage
- Optical microscope or SEM for inspection
- Process control and laser parameter software
- Safety and shielding equipment
Results and Deliverables
- Cleanly exposed semiconductor die and bond wires
- High-resolution internal structure images
- Failure location identification and defect mapping
- Detailed failure analysis and inspection report
- Documentation for reliability and quality evaluation
Partnering with Infinita Lab for Optimal Results
Infinita Lab addresses the most frustrating pain points in the Laser Decapsulation testing process: complexity, coordination, and confidentiality. Our platform is built for secure, simplified support, allowing engineering and R&D teams to focus on what matters most: innovation. From kickoff to final report, we orchestrate every detail—fast, seamlessly, and behind the scenes.
Looking for a trusted partner to achieve your research goals? Schedule a meeting with us, send us a request, or call us at (888) 878-3090 to learn more about our services and how we can support you. Request a Quote
Frequently Asked Questions
Laser decapsulation is a technique used to remove the protective encapsulation of semiconductor devices using a focused laser. It allows direct access to internal components for inspection, enabling accurate failure analysis without damaging sensitive structures.
It offers precise, localized material removal without chemical exposure. Unlike acid-based methods, it minimizes contamination, reduces processing time, and lowers the risk of damaging delicate semiconductor structures.
Plastic-encapsulated integrated circuits, microchips, and semiconductor packages can be processed. It is especially useful for modern high-density and miniaturized electronic components.
It enables accurate inspection of miniaturized and complex semiconductor devices, supporting reliability and failure analysis in advanced electronic systems.
Different wavelengths interact differently with materials. UV lasers are often preferred for fine precision, while IR lasers are used for deeper penetration and faster removal.
Request a Quote
Submit your material details and receive testing procedures, pricing, and turnaround time within 24 hours.
Quick Turnaround and Hasslefree process
Confidentiality Guarantee
Free, No-obligation Consultation
100% Customer Satisfaction
