Volume Resistivity of Conductive Adhesives ASTM D2739

Volume Resistivity of Conductive Adhesives ASTM D2739

The ASTM D2739 test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is performed on a thin adhesive film that has been created as part of a bonded specimen.

    Scope:

    The ASTM D 2739 test method is used to assess the volume resistivity of resin-based conductive adhesives in the cured state. This approach is used to assess the resistance of conductive adhesives employed in thin adhesive films that have been generated as part of a bonded specimen. The purpose of this test is to see if conductive adhesives cure at room temperature or at high temperatures. Acceptance testing and material screening can also be done using this procedure.

    Procedure:

    The volume resistivity of adhesive layers cured between metal adherents is measured on a  resistance bridge using the ASTM D2739 test technique. Tensile adhesion plugs, as well as any other test specimens or materials, can be utilized as long as the same preparation and tolerances are followed throughout the test technique. 

    Specimen size:

    Brass tensile adhesion specimens with electrical connections are used in the ASTM D2739 test method. 

    Data:

    As per the ASTM D2739, the volume resistivity of the test specimen is calculated as follows :

    V = R0A/L

    where,
    V = volume resistivity
    R0 = observed resistance of the test specimen
    A = cross-sectional area of the test specimen

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