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Printed circuit boards are utilized in the burn-in process and are known as burn-in boards. Extreme heat is applied to the newly inserted components on the board to stress them and reveal any flaws. Engineers review the results after the stress testing is finished to ensure that everything is operating within the specified limits.
Burn-in boards can be utilized in testing environments like:
The materials used must be durable because the burn-in process frequently applies tremendous temperatures ranging from 125°C to 250°C or even 300°C. Typically polyamide is utilized for applications up to 250°C and IS410 for applications up to 155°C. A higher grade of polyimide is employed for temperatures beyond 250°C. Along with stainless steel board fixtures, high temperature lead-free solders are also employed.
Materials Used in Burn-in Boards:
Burn-in Board Thickness:
The burn-in board thickness typically ranges from 0.0625 to 0.125 inches (1.57 mm –3.17 mm).
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